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		<title>IPC 8981:2025</title>
		<link>https://www.downstd.com/product/ipc-89812025/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 04 Jun 2025 10:53:49 +0000</pubDate>
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					<description><![CDATA[<p><strong>Quality and Reliability of E-Textile Wearables</strong></p><p>standard by Association Connecting Electronics Industries , 03/01/2025</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">standard by Association Connecting Electronics Industries , 03/01/2025</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">03/01/2025</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">32</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638162131</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 1.6 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Language:</span><span class="detail_meta_data_item_content">English</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is restricted and cannot be purchased in the following countries Russia, Ukraine, Belarus</span></div>
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<div class="detail_description">
<p><b>IPC 8981 PDF</b></p>
<p>This standard establishes criteria to assess the reliability of e-textile wearables through quality test methods. It enables the classification of the products against their reliable performance levels.</p>
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		<title>IPC 1792-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-1792-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:09 +0000</pubDate>
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					<description><![CDATA[<p><strong>Standard for the Management and Mitigation of Cybersecurity Incidents in the Manufacturing Industry Supply Chain</strong></p><p>Association Connecting Electronics Industries , 11/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">28</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161158</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 1 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
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<div class="detail_description">
<p><strong>IPC 1792 PDF</strong></p>
<p>This standard establishes requirements for companies to provide assurance that their products have been manufactured in cybersecure environments, ensuring that there has been no risk of impact to the product due to any cybersecurity incident. Requirements are specified covering actions that need to be taken in the event that a cybersecurity incident is detected, identifying all possibly affected products.</p>
<p>The target audiences for this standard are companies within the electronics manufacturing industry, cybersecurity supply chain managers and related organizations. This standard applies to the manufacture of final products as well as all component materials, paths and storage areas. External logistics processes are also covered via their responsibility to their customer.</p>
<p>This standard also defines levels of cybersecurity management that provide a choice when adopting this standard to meet the appropriate need. Pathways exist to enable progression from a basic level of cybersecurity maturity to higher levels. Appropriate levels for companies to adopt may be determined based on IPC Product Classification as well as risk analysis across all possible use cases of products.</p>
<p>This standard also includes mechanisms for third-party assessment to the cybersecurity levels defined in this standard.</p>
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		<title>IPC 9203A-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-9203a-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:09 +0000</pubDate>
				<guid isPermaLink="false">https://www.downstd.com/product/ipc-9203a-2022-pdf/</guid>

					<description><![CDATA[<p><strong>Users Guide to IPC-9202 and the IPC-B-52 Standard Test Vehicle</strong></p><p>Association Connecting Electronics Industries , 11/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">48</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161295</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 4 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
</div>
<div class="detail_description">
<p><strong>IPC 9203A PDF</strong></p>
<p>The electronics manufacturing process is often very complex, with dozens of variables that impact the quality and reliability of the manufactured assemblies in the end use environment. Of concern are the kinds of residues remaining on the electronic assembly and the effects that these residues have on the electro-chemical reliability of the end-product.</p>
<p>Surface Insulation Resistance testing measures changes to the surface insulation resistance. By its very nature, such testing must be conducted on a test coupon that should be representative of the intended end-product.</p>
<p>Apart from commonplace ionic residues, most modern process chemistries include non-ionic surfactant additives that are not detectable using ionic extract test methods such as Ion chromatography or Resistivity of Solvent Extracted (ROSE).</p>
<p>This document focuses on the IPC-B-52 standard test assembly and how it is used as a representative example of the intended end-product.</p>
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		<title>IPC HERMES-9852-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-hermes-9852-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:09 +0000</pubDate>
				<guid isPermaLink="false">https://www.downstd.com/product/ipc-hermes-9852-2022-pdf/</guid>

					<description><![CDATA[<p><strong>The Global Standard for Machine-to-Machine Communication in SMT Assembly Version 1.5</strong></p><p>Association Connecting Electronics Industries , 11/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">64</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161141</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 3.9 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
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<div class="detail_description">
<p><strong>IPC HERMES-9852 PDF</strong></p>
<p>The aim of this specification is to create a state-of-the-art communication protocol for handling board transfers and associated data at surface-mount technology (SMT) production lines. Therefore, this new communication protocol has to cope with the following:</p>
<p> • Replace the electrical SMEMA interface as specified in IPC-SMEMA-9851</p>
<p> • Extend the interface to communicate:</p>
<p>   – Unique identifiers for the handled printed circuit boards (PCBs)</p>
<p>   – Equipment identifiers of the first machine noticing a PCB</p>
<p>   – Barcodes</p>
<p>   – Conveyor speed and intended board route</p>
<p>   – A lightweight digital twin of the product containing, e.g.,</p>
<p> <img src="https://s.w.org/images/core/emoji/17.0.2/72x72/25aa.png" alt="▪" class="wp-smiley" style="height: 1em; max-height: 1em;" /> Product type identifier</p>
<p> <img src="https://s.w.org/images/core/emoji/17.0.2/72x72/25aa.png" alt="▪" class="wp-smiley" style="height: 1em; max-height: 1em;" /> Length</p>
<p> <img src="https://s.w.org/images/core/emoji/17.0.2/72x72/25aa.png" alt="▪" class="wp-smiley" style="height: 1em; max-height: 1em;" /> Width</p>
<p> <img src="https://s.w.org/images/core/emoji/17.0.2/72x72/25aa.png" alt="▪" class="wp-smiley" style="height: 1em; max-height: 1em;" /> Thickness</p>
<p> <img src="https://s.w.org/images/core/emoji/17.0.2/72x72/25aa.png" alt="▪" class="wp-smiley" style="height: 1em; max-height: 1em;" /> Board state</p>
<p>With respect to version numbers The Hermes Standard adheres to the rules of Semantic Versioning 2.0.0 [SemVer_2.0.0].</p>
<p>Hints on naming:</p>
<p> • Wherever a feature is described by the word “shall” it is mandatory.</p>
<p> • The word “machine” is used for any equipment which can be found in a SMT production line (e.g., printers, placement machines, ovens, AOIs, transport modules, shuttles, stackers).</p>
<p> • The term “PCB” may also refer to carriers transporting PCBs.</p>
<p> • The word “Hermes” is used as abbreviation for “The Hermes Standard”.</p>
<p> • “The Hermes Standard” and IPC-HERMES-9852 are synonyms for the standard specified in this document and might be used interchangeably.</p>
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		<title>IPC 2228-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-2228-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:08 +0000</pubDate>
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					<description><![CDATA[<p><strong>Sectional Design Standard for High Frequency (RF/Microwave) Printed Boards</strong></p><p>Association Connecting Electronics Industries , 10/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 10/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">10/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">36</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161165</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 3.6 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
</div>
<div class="detail_description">
<p><b>IPC 2228 PDF</b></p>
<p>This standard establishes the specific requirements for the design of rigid, flexible and rigid-flexible printed boards utilizing radio frequency (RF) and/or Microwave circuity and/or high frequency laminates where RF transmission lines and related passive metal layers are considered as distributed circuits, instead of conventional lumped circuit elements. This standard is used to support product typically requiring materials meeting the requirements of IPC-4103 and fabricated to the requirements of IPC-6018.</p>
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		<title>IPC 8971-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-8971-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:08 +0000</pubDate>
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					<description><![CDATA[<p><strong>Requirements for Electrical Testing of Printed Electronics E-Textiles</strong></p><p>Association Connecting Electronics Industries , 11/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">20</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161196</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 1.4 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
</div>
<div class="detail_description">
<p><strong>IPC 8971 PDF</strong></p>
<p>This document is intended to assist in selecting the test equipment, test parameters, test data and fixturing required to perform electrical test(s) on printed electronics on e-textiles.</p>
<p>Printed electronics on e-textiles are printed electronics on coated or treated textile substrates.</p>
<p>Coatings and treatments may be applied for printability of the textile substrate and/or for performance of the textile substrate or finished printed electronics e-textile (e.g., hydrophobic, water retardance, flame retardance, surface energy). Coatings or treatments may be applied using printing, lamination or other processes.</p>
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		<title>IPC 7092A-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-7092a-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:08 +0000</pubDate>
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					<description><![CDATA[<p><strong>Design and Assembly Process Implementation for Embedded Components</strong></p><p>Association Connecting Electronics Industries , 10/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 10/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">10/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">124</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638160946</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 8.2 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
</div>
<div class="detail_description">
<p><b>IPC 7092A PDF</b></p>
<p>This document describes the design, materials and assembly challenges associated with implementing embedded circuitry into a printed board. It covers various aspects of embedded circuitry related with the design, selection, processing and testing to achieve a completed multilayered structure that is ready for surface mount and/or through-hole component attachment.</p>
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		<title>IPC 1402-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-1402-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:08 +0000</pubDate>
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					<description><![CDATA[<p><strong>Standard for Greener Cleaners Used in Electronic Manufacturing</strong></p><p>Association Connecting Electronics Industries , 11/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">11/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">48</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161219</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 1.5 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
</div>
<div class="detail_description">
<p><strong>IPC 1402 PDF</strong></p>
<p>This standard applies to cleaning products used in the Electronics Manufacturing, including but not limited to original equipment manufacturers, electronics manufacturing services companies, board manufactures, cable and wire harness manufacturers and electronics industry suppliers.</p>
<p>This standard applies to direct use chemicals to clean products or components, as well as to clean manufacturing machines or tooling during operation and maintenance.</p>
<p>Cleaning product categories that are in scope of this document include but are not limited to:</p>
<p> • Removing solder and flux residuals from PCBs, components</p>
<p> • Cleaning of the contaminated surfaces inside reflow ovens</p>
<p> • Cleaning the flux residual on stencil, carrier, and frames</p>
<p> • Cleaning adhesive dispensing needles</p>
<p> • Screen wiping</p>
<p> • Optical lens cleaning</p>
<p> • Packaging printer cleaning</p>
<p> • De-bonding solutions for re-work or recycle</p>
<p> • Degreasing tooling and machine parts</p>
<p> • Stripping of coatings</p>
<p> Product categories that are out of scope of this document include but are not limited to:</p>
<p> • Demolding solutions</p>
<p> • Cleaners used in non-manufacturing activities (e.g., laboratory, office housekeeping, and maintenance unrelated to manufacturing)</p>
<p> • Surface treatment agents used to promote adhesion, etching and post etching operations, and chemical mechanical planarization</p>
<p> (CMP process).</p>
<p>This standard is focused on reducing the human health and environmental impacts and improving the safety of cleaning products used during the manufacturing process. This standard does not include or assess the performance of cleaning products.</p>
<p>This standard is targeted to define greener cleaners and does not replace the risk assessment associated with cleaning application under various working conditions.</p>
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		<title>IPC 8952-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-8952-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:08 +0000</pubDate>
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					<description><![CDATA[<p><strong>Design Standard for Printed Electronics on Coated or Treated Textiles and E-Textiles</strong></p><p>Association Connecting Electronics Industries , 12/01/2022</p>]]></description>
										<content:encoded><![CDATA[<div class="detail_meta_data">
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 12/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">12/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">56</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161202</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 2.6 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
</div>
<div class="detail_description">
<p><strong>IPC 8952 PDF</strong></p>
<p>This standard establishes specific requirements for the design of printed electronic applications and their forms of component mounting and interconnecting structures on coated or treated textile substrates. Textile substrate, as pertains to this standard, could be a bare textile or an integrated e-textile (e.g., woven or knitted e-textile).</p>
<p>Coated or treated textile substrates, as pertain to this standard, are textile substrates which have or will have a coating or treatment localized or across the full substrate.</p>
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		<title>IPC WHMA-A-620E-2022 PDF</title>
		<link>https://www.downstd.com/product/ipc-whma-a-620e-2022-pdf/</link>
		
		<dc:creator><![CDATA[admin]]></dc:creator>
		<pubDate>Wed, 08 May 2024 13:53:07 +0000</pubDate>
				<guid isPermaLink="false">https://www.downstd.com/product/ipc-whma-a-620e-2022-pdf/</guid>

					<description><![CDATA[<p><strong>Requirements and Acceptance for Cable and Wire Harness Assemblies</strong></p><p>Association Connecting Electronics Industries , 10/01/2022</p>]]></description>
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<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Standard By:</span><span class="detail_meta_data_item_content">Association Connecting Electronics Industries , 10/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Published:</span><span class="detail_meta_data_item_content">10/01/2022</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Pages:</span><span class="detail_meta_data_item_content">388</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">ISBN(s):</span><span class="detail_meta_data_item_content">9781638161028</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">File Size:</span><span class="detail_meta_data_item_content">1 file , 27 MB</span></div>
<div class="detail_meta_data_item"><span class="detail_meta_data_item_head">Note:</span><span class="detail_meta_data_item_content">This product is unavailable in Russia, Ukraine, Belarus</span></div>
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<div class="detail_description">
<p><strong>IPC WHMA-A-620E PDF</strong></p>
<p>This standard prescribes practices and requirements for the manufacture of cable, wire and harness assemblies. This standard does not provide criteria for cross-section or X-ray evaluation. For X-ray guidelines, see Appendix D X-Ray Guidelines.</p>
<p>If a conflict occurs between the English and translated versions of this document, the English version will take precedence.</p>
<p>The illustrations in this document portray specific points noted in the title of each section. The development committee recognizes that different parts of the industry have different definitions for some terms used herein. For the purposes of this document, the terms cable and wire harness are used interchangeably.</p>
<p>IPC/WHMA-A-620 can be used as a stand-alone document for purchasing products, however it does not specify frequency of in-process inspection or frequency of end product inspection. No limit is placed on the number of process indicators or the number of allowable repair/rework of defects. Such information should be developed with a statistical process control plan (see IPC 9191).</p>
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